High-performance arrays support 112Gbps PAM4 performance
Stephen LawElectronics Interconnect arrays High-Performance Interconnect
SAMTEC Next-gen AcceleRate HP High-Performance Arrays support 112Gbps PAM4 extreme performance in an ultra-micro footprint. Devices feature an open-pin-field array which maximizes grounding and routing flexibility. System architects can route high-performance differential-pairs, single-ended signals and high-current voltage rails via the same interconnect. Additionally, the 2.2 / 2.4 / 2.2mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and the ability to add more ground vias around the differential signals.