High density stacking connectors are solderless

BEL FUSE Cinch Connectivity Solutions CIN::APSE stacking connector series are solderless, high density, stacking interconnects used for board to board, flex to board and component to board applications. Devices are found in applications where a mezzanine style pcb layout is utilized to reduce space and weight. Device’s 1.0mm pitch accommodates high density circuits between boards. Product’s mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection.