Electronic Products & Technology

High density 0,5mm pitch edge card socket saves pcb real estate

EP&T Magazine   


SAMTEC BEC5 Series Edge Rate high-density edge card socket provides a bi-level mating design, two levels of contacts on a staggered 1mm (.0394″) centerline, creating a card effective 0,5mm (.0197″) pitch. Device is available with up to 140I/Os in a 1,00mm (.0394″) x 1,27mm (.050″) grid pcb pad layout (four rows of contacts). Product’s 0,5mm (.0197″) pitch high density socket accepts standard 1,60mm (.062″) and 2,40mm (.094″) thick cards. Additional features include weld tabs, alignment pins, and lead-free solder charge terminations for easy board processing.




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