Electronic Products & Technology

Heatsink for high power densities boosts heat dissipation

EP&T Magazine   

Electronics

OHMITE MV/MA 302 heatsink for applications requiring high power densities and where forced air cooling is present, provides improved heat dissipation. The longer, more efficient fin extrusions provide nearly twice the thermal performance as firm’s smaller MV/MA 102 product. Device is 2.2″ across by 1.71″ tall and uses the same installation mechanism which provides two internal spring clips for mounting up to four TO-247 or TO-264 devices.

http://www.ohmite.com

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