Electronic Products & Technology

Heat sinks require minimal pcb space around component

EP&T Magazine   


Advance Thermal Solutions (ATS) maxiFLOW line of heat sinks requires minimal space near components, around 1mm to maximize space on dense boards. Product permits easy removal and installation of heat sink. Device is available in 15mm up to 45mm, with three standard heights 7.5, 12.5 and 17.5mm.



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