Heat sink cools components in sizes from 27 to 70mm
Stephen LawElectronics Thermal management thermal management
ADVANCED THERMAL SOLUTIONS fanSINKS heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecom, optics, test/measurement, military and other applications. Devices feature cross-cut, straight aluminum fins, and support omnidirectional airflow for optimum cooling performance from attached fans and ambient air. Products are provided with a pre-assembled thermal interface material (TIM) to optimize heat transfer.