Electronic Products & Technology

Grid SMT Z-bend sockets, headers assemble parallel to pcb

EP&T Magazine   


MILL-MAX MFG .050″ (1,270 mm) and .100″ (2,540 mm) grid horizontal Z-Bend sockets and receptacles are surface mount SIP socket and header strips assembled parallel to the board surface. Devices are suitable for placement near the board edge for easy access test connections and creating pluggable adapter modules which can sit perpendicular to the motherboard (mated to a vertical connector).




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