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Graphite tool serves CGA1738 micro-coil spring


TOPLINE Graphite Tool for precision positioning of 0.4mm diameter Micro-coil springs onto BGA1738 organic substrates as an alternative to conventional solder balls. Micro-coil springs provide compliant interconnects between IC packages and the printed circuit board (pcb). The footprint of 1738 packages is 42.5mm x 42.5mm with a pad pitch of 1.0mm. After attaching Micro-coil springs, the reworked package provides more compliancy than ball grid array (BGA) solder balls to absorb stress caused by CTE mismatch, and to increase solder joint reliability under harsh operating conditions.


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