Electronic Products & Technology

Gap filler pads come in variety of material construction

Stephen Law   

Electronics Production / Materials filler gap management pads thermal

FUJIPOLY AMERICA Sarcon Standard Performance series offers four formulations of Standard Performance Gap Filler Pads, each have a different material construction in order to perfectly balance the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Products range in thickness from 0.50mm to 5.00mm. Depending on the material selected and application thickness, products will provide a thermal conductivity between 1.3 and 4.5W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Materials come in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit. Once installed, the silicone-based material efficiently transfers heat from heat-generating electronic components to a nearby heat sink. 

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