Gap filler boosts thermal performance

HENKEL  Gap Filler 1400SL thermal interface materials combines the properties of low viscosity and high thermal conductivity, relative to conventional self-leveling products. The two-part, silicone-based, liquid gap filling material has extremely low viscosity which allows the material to flow in and around tight, uniquely shaped structures to fill small voids and provide excellent thermal transfer. Product has a thermal conductivity of 1.4W/m-K, and is exceptionally soft when cured, allowing for absorption of coefficient of thermal expansion (CTE) stresses and providing mechanical shock dampening for fragile assemblies. http://www.henkel.com/electronics