Form-in-place thermal gap filler is silicone-free
Stephen LawElectronics Production / Materials compound materials production silicone-free
FUJIPOLY AMERICA SARCON SPG-25B-NS easy to dispense, low-viscosity, silicone free compound exhibits a thermal conductivity of 2.5W/m°K and a thermal resistance of 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material fills delicate gaps as small as 0.5mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance. Product delivers enhanced vibration absorption capabilities and requires no heat curing. It will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 120C).