Form-in-place gap filler boosts thermal transfer
Stephen LawElectronics Production / Materials Thermal management management materials production thermal
FUJIPOLY AMERICA SARCON SPG-70A form-in-place gap filler is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0W/m°K. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.2mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance. Product delivers improved vibration absorption capabilities and requires no heat curing. Product can be ordered in 30cc syringes or 325cc cartridges, as well as in custom packaging upon request.