Electronic Products & Technology

Epoxy for Potting & Encapsulations

Stephen Law   

Electronics Production / Materials encapsulation materials potting production Master Bond
Sponsored by Master Bond

PUBLISHER’S PICK

Master Bond EP4EN-80 is a one component, low viscosity epoxy that offers thermal conductivity, electrical insulation and a filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.

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main@masterbond.com

 

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