Epoxy delivers low coefficient of thermal expansion
Stephen LawElectronics Production / Materials Supply Chain epoxy epoxy
MASTER BOND EP30LTE-2 epoxy is developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. Product can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Product is a highly dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,000-26,000 psi and its CTE is very low at 10-13 x 10-6/in/in/°C. It is a reliable electrical insulator featuring volume resistivity of more than 1015 ohm-cm.
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