Enhanced reflow technology cools large thermal mass pcbs
REHM THERMAL SYSTEMS Vision Series convection reflow ovens provide cooling zone designs using technology effective for the homogenous cooling of large thermal mass PCBs. Depending upon the length of the system, the cooling area in the VisionXP is laid out in 2, 3 or 4 stages. The fans in the individual zones, which are available with separate speed/volume control, can cool even lead free processed PCBAs to below 50C. The system also provides precise cooling gradients that are critical to reduce thermal stress and resulting board twist and warp.