Engineering adhesives support manufacture of small, complex electronics
Stephen LawElectronics Production / Materials adhesives engineering materials production
BOSTIK Born2Bond HMPUR range of engineering adhesives support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations. Six new products have been added to the high-performance Hot Melt Polyurethane Reactive product range to deliver precision, durability and speed of application. Products are flexible and elastic, delivering high bonding strength on multiple substrates, including plastic, glass and metal, and is available in multiple viscosities. The high-performance products are suitable to structural parts bonding, touch panel bonding, acoustic assembly and auto display. Product provides good ageing resistance and enhanced humidity, sebum, temperature, chemical and impact resistance, also support durability and longevity requirements.
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