Electrically isolating epoxy boosts heat transfer capability

MASTER BOND EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. Product requires a cure at 80°C for 1.5 to two hours. To optimize performance properties, a post cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. Formulated for bonding, sealing and small encapsulating applications, product is electrically insulating, with a volume resistivity greater than 1014 ohm-cm. Product delivers a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. This high strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000 and 27,000 psi.

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