Electrically conductive die attach adhesive boosts thermal conductivity

MASTER BOND EP3HTSDA-1 single part, no mix epoxy adhesive for die attach applications exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. The 100% solids formulation provides a suitable viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically. Producdt has an unlimited working life at room temperature and will cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F. Product is NASA low outgassing approved., dimensionally stable and has a Shore D hardness of 75-85 and is engineered to withstand thermal cycling and shock. Epoxy system adheres well to metals, ceramics and silicon dies. Service operating temperature range is from -80°F to +400°F.