Dual curing epoxy meets biocompatibility, cytotoxicity needs
Stephen LawElectronics Production / Materials compound compund nanosilica nanosilica
MASTER BOND UV22DC80-1Med single component, nanosilica filled compound features a UV and heat curing mechanism. Product passes USP Class VI tests for biocompatibility, while also meeting ISO 10993-5 for cytotoxicity, making it suitable for many applications in the medical device industry. Product provides low shrinkage upon cure, improved abrasion resistance and dimensional stability with a low coefficient of thermal expansion of 30-35 x 10-6 inch/inch/°C. It is a reliable electrical insulator with volume resistivity of more than 1014 ohm-cm and dielectric constant of 3.85 at 60Hz. Product is optically clear with a refractive index of 1.52.
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