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Dual-curing adhesives achieve full strength at 60°C


DELO DualBond dual-curing adhesives reach full strength at only 60 °C after prefixation by light. Product range is completed by adhesives curing in a single step at low temperatures, three times faster than previous products. The epoxy resin-based adhesives are mainly used in electronics and can be prefixed after only half a second of exposure to light. Products boost adhesion to LCP and allow adjustment of the adhesive properties ranging from flexible to hard (elongation at tear up to 70%). Low curing temperature reduces the thermal stress between the materials, thus limiting the stress on the component. Product allows processing of temperature-sensitive substrates without difficulty: higher temperatures would only damage the sensitive components. https://www.delo-adhesives.com

 


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