Die attach epoxy with high Tg meets NASA outgassing specs
Stephen LawElectronics Production / Materials die-attachment epoxy can be used for bonding materials production sealing
MASTER BOND EP17HTDA-2 one component epoxy can be used for bonding, sealing and die attachment. Product is not premixed and frozen and cures with heat. This dimensionally stable system features improved mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. Product delivers enhanced temperature resistance with a service temperature range of -62°C to +316°C and a Tg of 185-190°C. Compound has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)], a low coefficient of thermal expansion, and is also electrically insulative with a volume resistivity greater than 1015 ohm-cm. It withstands a variety of chemicals including acids, bases, salts, fuels, oils, water and many solvents.
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