Dam & fill chip encapsulants serve smart card assembly apps

ENGINEERING MATERIAL SYSTEMS 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications are designed to protect wire bonds and reduce the stresses associated with thermal cycling. Materials are engineered to withstand circuit board reliability test criteria. The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centered at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required. http://www.conductives.com