
PIXUS TECHNOLOGIES Card guides for conduction cooled modules can be used in standard IEEE air-cooled enclosures. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101.10/.11 modular extrusions. Guide rails are designed for 160mm deep cards, but customized depths are available upon request. http://www.pixustechnologies.com
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