Electronic Products & Technology

Computer-on-Modules boosts performance in consolidated edge applications

Stephen Law   

Embedded Systems Computer-on-Modules edge

conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Based on high-end processor variants of the 13th Gen Intel Core processors, product’s target markets are performance-hungry industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge computing solutions with workload consolidation requirements for which congatec also supports real-time hypervisor

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