Computer-on-modules are highly powerful, yet passively cooled
Stephen LawAutomation / Robotics Electronics Semiconductors automation COM industrial semiconductors
CONGATEC Seven low-power variants of 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) are featured on seven COM-HPC and COM Express Computer-on-Modules. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume 15 to 28W base power, which enables engineers to utilize them in fully passively cooled embedded and edge computing platforms. This eliminates the need for costly cooling options and improves the ruggedness and MTBF of system designs. Target industrial markets for the new high-performance COM processors can be found wherever passively cooled computing systems need more performance. This includes, for example, edge computers and IoT gateways incorporating multiple virtual machines for smart factories and process automation, AI based quality inspection and industrial vision, real-time collaborative robotics, and autonomous logistics vehicles for warehousing and shipping.