Electronic Products & Technology

Circuit materials electrical, thermal/mechanical demands

October 22, 2017  Stephen Law

ROGERS RO1200 circuit materials meet the electrical and thermal/mechanical demands of high-speed designs, helping to maximize data throughput and minimize latency. With a low dielectric constant (Dk) of 3.05 and a maximum dissipation factor of 0.0017 @10 GHz, products provide improved signal integrity (SI), reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen-free UL 94 V-0 rating, products are suitable for demanding high-layer-count applications.


Print this page

Related Stories

Leave a Reply

Your email address will not be published. Required fields are marked *

*