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MEMS ultrasonic time-of-flight sensor is immune to ambient noise


TDK Chirp MEMS ultrasonic time-of-flight (ToF) sensors are immune to ambient noise and work in direct sunlight. Devices are robust, accurate and reliable, as well as small enough to fit into consumer electronics devices such as smartphones and wearables. Devices deliver the same performance and reliability as conventional ultrasonic sensors, but are up to 1000 times smaller and their power consumption is up to 100 times lower.

Model CH-101 comes with a maximum sensing range of 100 cm, and the long-range CH-201, offering a maximum range of 500 cm. Both devices combine a piezoelectric MEMS ultrasonic transducer (PMUT) with a custom low-power CMOS system on a chip (SoC) for all ultrasonic ToF signal processing in a compact 3.5 mm x 3.5 mm LGA package.

Chirp MEMS ultrasonic ToF sensors are up to 1000 times smaller and their power consumption is up to 100 times lower than conventional ultrasonic sensors.


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