Electronic Products & Technology

Chipset simplifies design of robust, future-proof solutions

Stephen Law   

Automation / Robotics Electronics Production / Materials Regulations & Standards Wireless Contract Manufacturing Engineering IoT Supply Chain chipset chipset

MELEXIS Time-of-Flight (ToF) chipset and development kit enables simple, modular and future proof design of 3D vision solutions. Chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. With this high level of integration, designers no longer have to be concerned with expensive (and space-hungry) external FPGAs and ADCs thereby reducing size, design cost, product cost and time-to-market. http://www.melexis.com



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