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Chipset simplifies design of robust, future-proof solutions


MELEXIS Time-of-Flight (ToF) chipset and development kit enables simple, modular and future proof design of 3D vision solutions. Chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. With this high level of integration, designers no longer have to be concerned with expensive (and space-hungry) external FPGAs and ADCs thereby reducing size, design cost, product cost and time-to-market. http://www.melexis.com

 


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