Chip-scale haptic IC drives HD touch in tiny designs
BOREAS TECHNOLOGIES BOS1901CW Wafer Level Chip Scale (WLCSP) version of FIRM’S flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices. Featuring WLCSP packaging device is 2.1×2.2×0.6mm and consumes just one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices. The high-voltage low-power piezo driver IC is based on firm’s patented CapDrive technology, a proprietary scalable piezo driver architecture. Device provides 10X power savings over other piezo solutions and delivers 4X to 20X power savings over other incumbent technologies (LRA, ERM).
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