Chip-scale haptic IC drives HD touch in tiny designs

BOREAS TECHNOLOGIES BOS1901CW Wafer Level Chip Scale (WLCSP) version of FIRM’S flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices. Featuring WLCSP packaging device is 2.1×2.2×0.6mm and consumes just one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices. The high-voltage low-power piezo driver IC is based on firm’s patented CapDrive technology, a proprietary scalable piezo driver architecture. Device provides 10X power savings over other piezo solutions and delivers 4X to 20X power savings over other incumbent technologies (LRA, ERM). 

click here for more info