Electronic Products & Technology

Chassis dev platform mixes in conduction, air cooled card guides

March 30, 2018  Stephen Law

PIXUS TECHNOLOGIES OpenVPX Development Chassis platforms provides a mix of card guides that allow IEEE 1101.10 air cooled and IEEE 1101.2 conduction cooled boards to be tested in the same enclosure. Product allows the use of Rear Transition Modules (RTMs) and up to 8 backplane slots at a 1” pitch. The open frame design provides a convenient approach to attach probes and easily access the plug-in boards. Firm offers various slot sizes and profiles of 3U and 6U OpenVPX backplanes compliant to the VITA 65 specification. A modular power supply allows various modules for +3.3V, +5V, +/- 12V, auxiliary voltages and other options to be assembled for the ideal power output for each configuration.

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