Board-to-board RF coaxial interconnect solutions enhance mechanical misalignment tolerances

RADIALL Extensive range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry. Four different product groups and 10 connector series include SMP-MAX, SMP-Spring, IMP-Spring as well as others. SMP-MAX model has a patented impedance matching insulator, optimized for a larger operating gap between connectors, providing a maximum board-to-board distance tolerance of up to .078 (2 mm) gap without a spring.

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