Bluetooth 5.2 SoC optimized for compact, two-layer PCB wireless products

Stephen Law June 21, 2020

NORDIC SEMICONDUCTOR nRF52805 Bluetooth 5.2 System-on-Chip (SoC) is an ultra low power Bluetooth Low Energy (Bluetooth LE) SoC supplied in a wafer level chip scale package (WLCSP) measuring 2.48 x 2.46mm. Device is optimized for two-layer pcb designs – eliminating the need for more expensive four-layer pcbs to significantly cut costs in compact, budget-constrained designs. Device is capable of Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 (CSA #2) for improved coexistence. Device features a 64-MHz 32-bit Arm Cortex-M4 processor (144 CoreMark) with enhanced efficiency (65 CoreMark/mA) and includes 192KB Flash plus 24KB RAM.