BGA sphere boosts thermal reliability
Stephen LawElectronics Production / Materials materials production
SHENMAO AMERICA PF918-S Lead-Free BGA Sphere features high-reliability alloy that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy. A board-level thermal cycling test with an automotive IC product showed that the thermal cycling life is two times longer than the SAC305 alloy. The melting point is 211°-221°C. Product is formulated with firm’s Sn/Ag4.0/Bi3.0 alloy that is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements. The lead-free BGA sphere can increase thermal reliability performance by a minimum of 30 percent. It provides improved mechanical shock, tensile strength and thermal cycling performances.