Electronic Products & Technology

BGA socket suited to 0.50mm pitch BGA device test, validation

EP&T Magazine   


ADVANCED INTERCONNECTIONS Mod5 Series Flip-Top BGA Socket requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. Product provides a compact, surface mount test solution for micro-BGA chipsets used in test, debug and validation of 0.50mm pitch devices. The compact device with surface mount design provides precision machined spring probes with industry proven solder balls ensure high reliability performance.



Stories continue below

Print this page

Related Stories