Backplane’s orthogonal architecture improves thermal efficiencies

SAMTEC ExaMAX High-Speed Backplane Connector System with direct mate orthogonal (DMO) architectures option provides system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. System architecture increases airflow and improves thermal efficiencies throughout the chassis. DMO solutions enhance signal integrity via shorter trace lengths and less connector transitions while streamlining the system BOM and optimizing system cost. Both 6 pair x 10 column and 6 pair x 12 column solutions are available. Guide pin and screw mount options are also available.