OMRON VT-X750 Automatic X-ray Inspection system incorporates the latest solution for manufacturers desiring high quality, in-line, automated X-ray inspection on pcbs, containing components such as BGAs or LGAs and through-hole connectors. Unit provides high-precision, X-ray imaging to perform precise and reliable analysis of these hidden soldered areas. Unit can inspect accurately and reliably, soldered defects such as head-in-pillow and voids within BGA and LGA devices. System also measures the percentage solder, including voids in QFN’s, and Barrel Fill in through-hole devices. Unit performs inspections at speeds less than 4 msec. per field-of-view (FOV).