Electronic Products & Technology

Assembly film boosts reliability, adhesion at high temps

September 26, 2018  Stephen Law

HENKEL LOCTITE ABLESTIK CF 3366 epoxy-based, silver-filled film adhesive provides high thermal and electrical conductivity, delivering improved heat dissipation capabilities for robust thermal management. Leapfrogging other commercial assembly films, product addresses miniaturization trends, increasing power density demands and high operating temperature environments. Available in custom sizes, product can be used in high operating temperature environments where extreme reliability is required.


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