Electronic Products & Technology

Aluminum nitride ceramic chip transfers heat

EP&T Magazine   

Electronics Thermal management aluminum-nitride ceramic chip heat-spreader thermal management

INNOVATIVE POWER PRODUCTS Cool Chip IPP-CCN0805 aluminum nitride ceramic heat spreader chip is designed to draw heat from one location that is too hot and move it to a different location that can absorb the heat. Devices are manufactured on a highly thermally conductive ceramic substrate that is electrically isolated and safe to use. The Aluminum Nitride substrate has a thermal conductivity of 170W/mK. Terminals are gold-plated over nickel, making them easy to solder with many different alloy types. Devices are suitable for small, compact areas with high heat concentrations, intended for both military and commercial applications. Made in the USA.

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