ZYMET UA-3307-B Edgebond adhesive enhances board level reliability in automotive and other harsh environment applications. When BGA’s and WLCSP’s have their corners and edges bonded with this product, the device have passed more than 2000 cycles of -40°C to 125°C thermal cycling without failure. Large WLCSP’s exceeding 8-mm in size have passed more than 1500 cycles. No component underfill is required, eliminating board preheat and dwell time. There is no risk of underfill voids caused by flux residues impeding flow.