8W thermal putty serves as compressible gap filler
FUJIPOLY AMERICA SARCON PG80B high-performance putty-like thermal interface material is a compressible gap filler that delivers a thermal conductivity of 8.0W/m°K with a thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. Product requires a low compression force, even under high compression rates, to make reliable contact between heat-generating components and nearby heatsinks. Material characteristic makes it suitable for applications with delicate or varied height components on the pcb. Product is available in four sheet thicknesses (0.5, 1.0, 1.5, 2.0mm) up to a maximum dimension of 300mm x 200mm. It can be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40 to +150°C.