5.0 W/m°K FIP thermal compound fills gaps on fragile solder points

FUJIPOLY SARCON SPG-50A high-performance form-in-place (FIP) gap filler compound is a 5.0 W/m°K silicone based material, serving as an option for electronic devices that have delicate components or ultra-low compression force requirements. The form stable material fills large gaps around fragile circuit board solder points without causing damage or loss in performance. This facilitates efficient transfer of heat from any board-level source to a nearby heat sink or heat spreader. Due to its composition, the thermal compound improves vibration absorption capabilities and maintains all initial properties across a wide temperature range (-40C to + 150C). Product is available in easy-to-use tubes or syringes.  http://www.fujipoly.com