4.5W thermal putty serves as thermal interface
FUJIPOLY AMERICA Sarcon PG45A high-performance, putty-like thermal interface material is a low modulus gap filler that exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5W/m°K. Product requires very low compression force at high compression rates making it suitable for applications that have delicate or wide-variation component heights requiring material compression up to 70-90%. Product is available in three sheet thicknesses (1.5, 2.0, and 2.5mm) up to a maximum dimension of 300mm x 200mm. Product can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40 to +150°C.
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