3D solder paste inspection enables high-speed, accuracy

YAMAHA MOTOR YSi-SP, a high-speed 3D solder paste inspection (SPI) machine enables high-speed, high-accuracy inspection based on firm’s 1-head solution concept for using a single type of head to handle multiple inspections. Unit inspects the print quality (volume, height, area, misalignment) of solder paste after it has been printed onto a pcb. Product can accommodate various high-speed and high-accuracy solder paste inspections with a single head, including high-precision inspections.