3D AOI system boost inspection process
Automation / Robotics
Production / Materials
Test & Measurement
NORDSON YESTECH FX-940 ULTRA 3D AOI system provides high-powered inspection with an improved false call rate. Unit runs faster than 2D systems, while dramatically improving coverage. Product can be used for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.