Electronic Products & Technology

3D AOI system boost inspection process

September 4, 2017  Stephen Law

NORDSON YESTECH FX-940 ULTRA 3D AOI system provides high-powered inspection with an improved false call rate. Unit runs faster than 2D systems, while dramatically improving coverage. Product can be used for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.


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