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Fast cure conductive adhesive for small to medium-size chip bonding


EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small to medium-size die and tantalum capacitors cures in one minute at 170ºC. Adhesive is stress-absorbing, designed to withstand the rigors of thermal cycling and improves conductive stability. Material can be applied by pin transfer or needle dispensing. http://www.emsadhesives.com


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