MASTER BOND EP21AOLV-2Med epoxy is thermally conductive and electrically isolating with a smooth consistency and good flow properties. Product bonds well to metals, composites, glass, ceramics, plastics and many rubber materials. The dimensionally system provides a high tensile modulus of 450,000-500,000 psi, a compressive strength exceeding 18,000 psi and very low shrinkage upon curing. Product’s viscosity and low coefficient of thermal expansion enable it to be suitable for potting and encapsulation applications. Product also resists many chemical including water, oils and fuels. Medical grade product is serviceable over the temperature range of -60F to +250F.
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