Electronic Products & Technology


August 20, 2018 by Stephen Law

Automatic profiling system displays real-time dashboard

KIC RPI i4.0 automatic SPS thermal profiling system provides network software for real-time dashboard, data sharing and traceability storage. Product automatically acquires profile data from each product soldered in the reflow or curing oven, in real-time. The ecosystem delivers full…
August 15, 2018 by Stephen Law

Compact fans include global voltage range

EBM-PAPST ACi4400 Series GreenTech EC Compact Fans provide versatility with the addition of 90 – 264Vac models and include all features and benefits of originals. Highly efficient, long-lasting devices provide flexibility of both 115V and 230V options. Product series provides 75%…
June 21, 2018 by EP&T Magazine

Allied Electronics & Automation inks disty deal with Seek Thermal

Allied Electronics & Automation has signed a distribution agreement with Seek Thermal, manufacturer of thermal imaging technology. “We are very excited to add Seek Thermal to our product offering,” says product director Marie Dawson.  “Our customers are consistently looking for…
June 20, 2018 by Stephen Law

Thermal imaging camera comes with interchangeable lenses

ITM INSTRUMENTS – FLIR E75 Thermal Imaging Camera 320 x 240 provides interchangeable lenses (14°, 24°, 42°) that auto-calibrate with the camera, as well as a vibrant 4″ touchscreen with scratch-resistant Dragontrail cover glass and a fast and responsive interface.…
June 12, 2018 by Stephen Law

Thermal management tool supports development engineers

LAIRD TECHNOLOGY Thermal Wizard web-based thermal management tool helps engineers quickly select the optimum solution for their application. Product employs proprietary application calculators to determine the optimal thermal management solutions at the thermoelectric module, thermoelectric assembly or liquid cooling system…
June 5, 2018 by Stephen Law

One-part silver conductive epoxy delivers ultra-high heat transfer

MASTER BOND EP3HTSDA-2 Silver filled epoxy adhesive system serves crucial thermal management applications. As a one component system, it is not premixed and frozen and has an ‘unlimited’ working life at room temperature. Compound possesses a high thermal conductivity of…
May 29, 2018 by Stephen Law

17W thermal interface pad lowers thermal resistance

FUJIPOLY AMERICA Sarcon 30XR-m high-performance thermal interface material exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape. When placed between…
March 8, 2018 by Stephen Law

Pre-cured, single component silicon solution minimizes the mix

SHIN-ETSU SILICONES  CLG series single-component, pre-cured gap filler silicones improve resistance against pump-out for advanced thermal management electronics applications. Gap filler greases are simpler to use, requiring no mixing or use of a two-part meter-mix equipment system. Material does not…
April 25, 2017 by Stephen Law

Thermal gap filler eliminates performance-hindering air gaps

FUJIPOLY SARCON SPG-30B form-in-place thermal gap filler eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. Product delivers improved thermal conductivity of 3.1 W/m°K with a thermal resistance of 0.33°Cin2/W. The ultra-low compression force silicone compound completely fills all spaces,…
March 26, 2017 by Stephen Law

Smart profiling system transforms thermal process

KIC SPS thermal reflow profiler transforms thermal process data collection from a costly chore to a value-added function. Unit’s core function is to produce an acceptable profile on each pcb, collecting data and comparing it to the process specifications. Within…
May 11, 2016 by Stephen Law

Thermal interface materials enabling new applications

While there are obviously similarities, different applications have different key requirements of thermal interface materials (TIM), according to a market report from IDTechEx. In all cases, the TIM needs to minimize stress, prevent electro-migration of its fillers and maximize adhesion.…
April 30, 2016 by Stephen Law

Thin film thermal interface boosts performance

FUJIPOLY AMERICA  Sarcon YR‐c thermal interface product provides a high level of performance, based on a new formulation delivering a thermal conductivity of 4.0 W/m°K with a thermal resistance of .08°Cin2/W. When placed between a heat source such as a…