Thermal solution material for pcb fabrication

RISHO AC-7303 Copper Clad Laminate (CCL) thermal solution material for pcb fabrication is made with an Al base ideal for high-thermal pcbs. Product provides a thermal conductivity of 3W/mK; an extremely low modulus (1/10 that of conventional material); and a flexible dielectric layer (after curing). With an aluminum-base, product creates a soft insulation layer even after thermosetting.