Stackable BGA mezzanine connector supports up to 112Gbps
Stephen Law
Electronics Interconnect ball-grid-array BGA connector hermaphroditic Hirose Interconnect mezzanine stackableHIROSE ELECTRIC IT14 Series hermaphroditic, stackable ball grid array (BGA) mezzanine connector designed for high-speed and high-density server applications. Device features a self-mating design to eliminate the need for additional mating parts. Fewer mating parts not only reduces costs, but also increases reliability and enhances performance. Product supports high-speed data transmission more than 56Gbps NRZ / 112Gbps PAM4. An Ethernet OAM specified connector, device utilizes a high-density design (172DPs/in2) to meet telecom and networking application requirements. Product has a stub-less 2-point contact design for ultra-reliability. A protective housing encapsulates the contact tips to prevent warping during mating.
