VisionMaster M500 manual 3-D 3-D solder paste inspection (SPI) unit uses advanced white light Moiré interferometry to build height data for every pixel in the view. The benchtop unit does not require any maintenance and is designed to provide years of trouble-free usage. Rugged yet light and portable, the sensor is machined from aircraft grade aluminum and is mounted on a vibration damping, ESD resistant granite base.
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